Thermal engineer who ships consumer electronics. 8+ years taking products from first concept through mass production — thermal validation (IR imaging, thermocouples, automated test frameworks), thermal simulation, evaluation of thermal solutions, and software thermal management policies that balance performance with thermal comfort and safety.
Master of Science
Mechanical Engineering (minor: Computational Science)
GPA: 3.67/4
Bachelor of Technology
Mechanical Engineering
GPA: 9.03/10
Hardware thermal testing to quantify usefulness of PCMs in cooling smartphones.
Improving effective thermal conductivity of PCM-based passive cooling.
Characterize thermal resistance of PCMs using IR camera and reference bar method (ASTM D5470 standard).